CPOS Seminar: Large Area Elastomer-Based Printed Electronics

Date and Time
Location
Location: HYBRID: In-person: PSBN 4606 / Zoom
Dr. Peter Zalar photo
Dr. Peter Zalar photo

Speaker: Dr. Peter Zalar - Program Manager - Large-Area Sensors at Holst Centre, Eindhoven, North Brabant, Netherlands  

Bio: Peter Zalar obtained his Ph.D. in chemistry from the University of California, Santa Barbara (UCSB) in 2014 under the supervision Prof. Thuc-Quyen Nguyen. His doctoral research focused on the characterization of the optical and electronic properties of novel pi-conjugated polymers. He then joined the group of Prof. Takao Someya at The University of Tokyo as a project researcher. In that time, he worked on the development of optoelectronic devices based on organic semiconductors for electronic skins and wearable medical monitoring. In 2017, he joined Holst Centre / TNO to continue his research in printed, flexible, and large-area electronics. He is currently leading the “Large Area Sensors” and “Functional Hybrid Arrays” research programs at the Holst Centre.
 
Abstract: Holst Centre is a leading applied research institute focusing on the development of flexible and thin electronic systems using industrially relevant fabrication methods. For nearly two decades, our primary objective has been to make technological advancements that facilitate the industrialization of printed electronics systems, thereby turning future visions into reality.

With the increasing demand for integrating electronics into a wide range of form factors, it is essential to develop systems that possess key qualities such as accuracy, conformability, ruggedness, lightweight design, and sustainability. These qualities are crucial in applications spanning healthcare, automotive, and robotics, where traditional rigid printed circuit board (PCB) technology falls short. To address this challenge, we have explored the use of elastomeric carriers as a viable solution. In this presentation, I will delve into Holst Centre's contributions towards the development of sensor systems on elastomeric carriers, highlighting our efforts on an all-printed, large area, multimodal sensing surface.